Focus X-ray CT system - List of Manufacturers, Suppliers, Companies and Products

Focus X-ray CT system Product List

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X-ray CT system imaging example: CT cross-section of solder cracks

Introducing a case study of tomographic imaging of solder cracks inside semiconductors captured using a micro-focus X-ray CT system!

The micro-focus X-ray CT system 'XVA-160RZ' is an X-ray CT system that can visualize high-resolution fine internal structures used in applications such as non-destructive testing and material analysis. You can choose between a high-resolution type and a wide-field type. This time, we will introduce a case study of the micro-focus X-ray CT system 'XVA-160RZ'! It is a case where a cross-section of solder cracks inside a semiconductor was captured. 【Details】 ■ Industry of the company that introduced the system Semiconductor, electronic components, and electronic equipment manufacturing ■ Purpose of introduction Quality assurance, failure analysis ■ Effects of introduction Increased productivity due to improved success rate of failure analysis Improved yield due to faster identification of defect causes *For more details, please check the PDF download.

  • Non-destructive testing

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[UHS_X-ray CT System Imaging Case] First Generation Smartphone

This is a case of the first-generation smartphone captured with a transparent image and oblique CT scan. It allows for the observation of the internal structure and the condition of the internal memory.

The "XVA-160RZ" is a micro-focus X-ray CT system used in applications such as non-destructive testing and material analysis. This system can visualize fine internal structures with high resolution. Additionally, you can choose between a high-resolution type and a wide-field type. This time, we will introduce a case study of the micro-focus X-ray CT system "XVA-160RZ"!

  • Non-destructive testing

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[UHS_X-ray CT System Imaging Case] Smartphone (2018)

This is a case of a smartphone (2018 model) that was imaged using transparent imaging and angled CT scanning. It allows for the observation of the internal structure and the condition of the internal memory.

The "XVA-160RZ" is a micro-focus X-ray CT system used in applications such as non-destructive testing and material analysis. This system can visualize fine internal structures with high resolution. Additionally, you can choose between a high-resolution type and a wide-field type. This time, we will introduce shooting examples of the micro-focus X-ray CT system "XVA-160RZ"! On a separate page, we have published the first-generation smartphone. Changes in the internal structure can be observed comparatively.

  • Non-destructive testing

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[UHS_X-ray CT System Imaging Example] microSD WB

This is a case of wire bonding imaged using the "NanoFocus X-ray CT System XVA-160αII 'Z'."

This is an example of an image taken with oblique CT of microSD wire bonding. The wire bonding can be clearly observed. The "XVA-160αII 'Z'" is a nano-focus X-ray CT system used in applications such as non-destructive testing and material analysis. This system is a super high-resolution model that achieves ultra-high magnification (2,000 times) and nano-order sizes (250/800nm).

  • Non-destructive testing

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【X-ray CT system imaging example】CT tomography with a smartphone-mounted CPU

Introducing a CT imaging case of a smartphone-mounted CPU captured with a micro-focus X-ray CT system!

The "XVA-160RZ" is a micro-focus X-ray CT system used in applications such as non-destructive testing and material analysis. This system can visualize fine internal structures with high resolution. Additionally, users can choose between a high-resolution type and a wide-field type. This time, we would like to introduce a case study of the micro-focus X-ray CT system "XVA-160RZ"! It is a case where a CT scan of a smartphone-mounted CPU was performed. 【Details】 ■ Industry of the company that introduced the system Semiconductor, electronic components, and electronic equipment manufacturing ■ Purpose of introduction Quality assurance, failure analysis ■ Effects of introduction Increased productivity due to improved success rate of failure analysis tasks Improved yield due to faster identification of defect causes *For more details, please check the PDF download.

  • Non-destructive testing

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